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Originally posted by Double-Trinity
Are OMAPs ARM based? If not, we probabyl won't be seeing them on PPCs, only on Palms and maybe Sharp Zaurus.
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Apparently they will be ARM compatible. Here's a link to some info:
http://www.pdalive.com/forums/showth...&threadid=2950
Just in case the link doesn't work... This was posted by Beng Yeow of PDALive on Feb 3/03
"Texas Instruments Incorporated has unveiled five new OMAP processors with on-chip security that are targeted at multimedia applications in advanced wireless handset, smart-phone and PDA designs.
According to TI, applications featuring 2D graphics will run up to 2.5x faster, Java execution performed up to 8x faster, and the enabling Multimedia Instruction Set Architecture (ISA) extensions can provide up to 1.7x performance gain for audio applications such as digital audio playback.
Security algorithms are also processed up to 90x faster while power consumption is reduced, thanks to the OMAP platform's hardware accelerators. In addition, an "extreme deep sleep mode" is also on tap that reduces power consumption to less than 10 micro-Amperes (µA) of current, which is equivalent to a 10x reduction in the standby power drain of previous generation processors, claims the company.
TI's latest OMAP devices are compatible with the Linux, Nucleus, Palm OS, Symbian, Pocket PC and Smart-phone operating systems, as well as backward compatible with TI's OMAP1510, OMAP310 and OMAP710 processors. Three of the new MAP161x series devices, the OMAP1610, OMAP1611 and OMAP1612, can be coupled with chipsets for all cellular standards. The remaining two devices, the OMAP730 and OMAP732, are single chip offerings that integrate a GSM/GPRS modem baseband subsystem with a dedicated application processor.
The OMAP1611 processor features 2MB of internal SRAM (ISRAM), a standard low pin-count, and a dedicated connection 54 Mbit/sec WLAN (802.11g/a/b) technology. The OMAP1612 processor includes all of the OMAP1611's previously mentioned features, together with 256 MB of stacked ultra-low-power, mobile double data rate (DDR) synchronous dynamic memory (SDRAM).
TI's new OMAP73x series has been integrated into a wireless chipset and reference design that combines a GSM/GPRS Class 12 modem baseband processor and a dedicated application processor on a single chip. The OMAP730 reportedly delivers twice the application performance over the OMAP710 processor while doubling standby time. TI also reports that designs using the new OMAP730 device will require less than half the board space of the previous generation. In addition, the OMAP730 features an internal SRAM frame buffer memory and a dedicated connection to 54 Mbit/sec WLAN (802.11g/a/b) technology. The OMAP732 processor expands upon the abilities of the OMAP730 device by offering to 256 Mb of stacked mobile SDRAM in support of advanced smart-phone and PDA design applications.
Based on TI's 0.13-micron process technology, the OMAP1610, OMAP1611 and OMAP730 devices are expected to begin sampling in 1Q03 while OMAP1612 and OMAP732 devices with stacked memory are scheduled to sample in 2Q03. Production volumes of all five processors are scheduled to be available in the 4Q03.
TI has also announced a new four-chip dual-mode TCS4105 UMTS chipset and reference design that can be combined with one of TI's OMAP application processors to support 3G multimedia applications in 3G wireless handset and PDA designs. Designed in compliance with the 3GPP Release 99 specification for UMTS, the programmable chipset includes TI's new OMAP1610 processor, which supports the Windows CE, PalmOS, Symbian OS and Linux operating systems.
The new chipset's TBB4105 digital baseband processor offers support for WCDMA up to 384kbit/sec, as well as Class12 GSM/GPRS. The device also features TI's TMS320C55x DSP as well as an ARM926 processor.
The chipset's TWL3024 analog baseband processor has been designed to integrate the analog and power management functions of the complete chipset and applications processor into a single device. The TWL3024 also features TI's power management system, which reduces power consumption by partitioning the system as well as placing portions of the handset into low-power standby mode whenever possible to do so. According to the company, the battery life of a 3G mobile device featuring TI's TCS4105 and OMAP1610 processor will enjoy a 2X increase in standby time.
The new UMTS chipset also includes a two-chip RF transceiver subsystem that is designed to enable the chipset's dual-mode GSM/GPRS and WCDMA capabilities. Based on advanced direct conversion (DC) technology, both the TRF6151 GSM/GPRS transceiver and the TRF6301 WCDMA transceiver integrate a number of external devices, including VCOs, LNAs, PLL loop filters, and synthesizers.
TCS4105 UMTS development chipsets have been available since the second quarter of 2002. Availability of TCS4105 commercial samples is expected in 3Q03, while full-scale production of chipset and software is planned for 1H04. In addition, the 1H04 release will include a UMTS chipset reference design that will include a complete bill of materials, communications and multimedia software suite and board design and layout."
Chris...
